Shenzhen Photonics Valley achieved a breakthrough in TGV Interposer technology

Recently, Shenzhen Photonics Valley Technology Co., Ltd (SPVTECH), a high-density optoelectronic integration and optical communication technology solution provider, has made an important breakthrough in glass through-hole optoelectronic transfer (TGV Interposer) technology. SPVTECH, in collaboration with Shanghai Jiaotong University and Shenzhen University, has developed a wafer-level TGV optoelectronic interposer process, realizing the first domestic 8-inch wafer-level TGV interposer processing, with a measured bandwidth of 110GHz, which can be used for 2.5D and 3D optoelectronic integrated packaging applications, and provides high-speed, high-density, high-reliability and low-cost optoelectronic co-packaging (CPO) solutions for optical module products of VCSEL, DML, EML, silicon photonics, lithium niobate and other technical routes.

Glass-based advanced packaging technology has received great attention in recent years and has outstanding application advantages in integrated passive devices (IPD), microdisplay, AR/VR and other fields. Glass has naturally friendly optical properties. Laser-induced etching can achieve high aspect ratio glass through-hole processing and can support large-size wafer-level and panel-level processing. Its stable optoelectronic properties also bring the advantage of high reliability. On September 18, 2023, Intel launched the most advanced processor packaged with a glass substrate, which is scheduled for mass production from 2026 to 2030. The co-packaged optical element technology (CPO) based on the glass substrate design will also bring disruptive applications in scenarios such as data centers, artificial intelligence and graphics construction.

The TGV optoelectronic interposer developed by SPVTECH uses laser induced etching combined with multi-layer redistribution (RDL) technology, with a through-hole aspect ratio of 4:1, a substrate thickness of 230um, a surface flatness of 1.2um, support for 2+1 layers of RDL, a trench depth of 60um, support for coupling alignment of optical fiber arrays, support for flipchip packaging of electrical chips, support for flip-chip mounting of optical chips such as EML/SOA/silicon photonics/lithium niobate, and the measured through-hole and RDL wiring bandwidth exceeds 110GHz.

SPVTECH focuses on high-density optoelectronic integrated chips, optical connectors and optical fiber link technologies for optical transmission and optical interconnection. The glass-based optoelectronic switching technology (TGV Interposer) will be further combined with Shenzhen Optics Valley’s high-density space-division multiplexing technology to form a connection in glass laser direct writing optical connectors, space-division multiplexing technology fan-in and fan-out devices, etc., thereby giving full play to the advantages of full-link high density and supporting wide applications in data centers, computing clusters, large-capacity transmission and other fields.